고밀도 핀배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술Thermo-Compression Ultrasonic Bonding Technology for Mounting IT Components with High-Density Pin Counts

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Publisher
한국정밀공학회
Issue Date
2008
Language
KOR
Citation

한국정밀공학회 2008년도 추계학술대회 논문집, pp.47 - 48

URI
http://hdl.handle.net/10203/158055
Appears in Collection
ME-Conference Papers(학술회의논문)
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