Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jee, YK | - |
| dc.contributor.author | Kim, JY | - |
| dc.contributor.author | Yu, Jin | - |
| dc.contributor.author | Lee, TY | - |
| dc.date.accessioned | 2013-03-27T01:11:26Z | - |
| dc.date.available | 2013-03-27T01:11:26Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-11-19 | - |
| dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007, v., no., pp.S1-b p3 - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/157762 | - |
| dc.language | ENG | - |
| dc.title | Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-51249086453 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | S1-b p3 | - |
| dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Jee, YK | - |
| dc.contributor.nonIdAuthor | Kim, JY | - |
| dc.contributor.nonIdAuthor | Lee, TY | - |
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