DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, JW | - |
dc.contributor.author | Suk, KL | - |
dc.contributor.author | Paik, KW | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.date.accessioned | 2013-03-27T01:01:38Z | - |
dc.date.available | 2013-03-27T01:01:38Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-11-18 | - |
dc.identifier.citation | 4th International Conference on Experimental Mechanics, v., no., pp.119 - | - |
dc.identifier.uri | http://hdl.handle.net/10203/157704 | - |
dc.language | ENG | - |
dc.title | Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-79958112034 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 119 | - |
dc.citation.publicationname | 4th International Conference on Experimental Mechanics | - |
dc.identifier.conferencecountry | Singapore | - |
dc.identifier.conferencecountry | Singapore | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Jang, JW | - |
dc.contributor.nonIdAuthor | Suk, KL | - |
dc.contributor.nonIdAuthor | Paik, KW | - |
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