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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire

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dc.contributor.authorPark, JHko
dc.contributor.authorJang, KWko
dc.contributor.authorPaik, KWko
dc.contributor.authorLee, Soon-Bokko
dc.date.accessioned2013-03-27T00:53:29Z-
dc.date.available2013-03-27T00:53:29Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-12-09-
dc.identifier.citation10th Electronics Packaging Technology Conference, EPTC 2008, pp.633 - 638-
dc.identifier.urihttp://hdl.handle.net/10203/157640-
dc.languageEnglish-
dc.publisher123-
dc.titleReliability evaluation for flip-chip electronic packages under high temperature and moisture condition using moire-
dc.typeConference-
dc.identifier.wosid000265818600101-
dc.identifier.scopusid2-s2.0-63049091035-
dc.type.rimsCONF-
dc.citation.beginningpage633-
dc.citation.endingpage638-
dc.citation.publicationname10th Electronics Packaging Technology Conference, EPTC 2008-
dc.identifier.conferencecountrySI-
dc.identifier.conferencelocationSingapore-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorPark, JH-
dc.contributor.nonIdAuthorJang, KW-
dc.contributor.nonIdAuthorPaik, KW-
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ME-Conference Papers(학술회의논문)
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