DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, HY | - |
dc.contributor.author | Paik, KW | - |
dc.contributor.author | Kim, I | - |
dc.contributor.author | Park, JH | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Jung, GJ | - |
dc.contributor.author | Park, BJ | - |
dc.contributor.author | Byun, KY | - |
dc.date.accessioned | 2013-03-27T00:01:15Z | - |
dc.date.available | 2013-03-27T00:01:15Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-12-09 | - |
dc.identifier.citation | 10th Electronics Packaging Technology Conference, EPTC 2008, v., no., pp.716 - 724 | - |
dc.identifier.uri | http://hdl.handle.net/10203/157338 | - |
dc.language | ENG | - |
dc.title | Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-63049109308 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 716 | - |
dc.citation.endingpage | 724 | - |
dc.citation.publicationname | 10th Electronics Packaging Technology Conference, EPTC 2008 | - |
dc.identifier.conferencecountry | Singapore | - |
dc.identifier.conferencecountry | Singapore | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Son, HY | - |
dc.contributor.nonIdAuthor | Paik, KW | - |
dc.contributor.nonIdAuthor | Kim, I | - |
dc.contributor.nonIdAuthor | Park, JH | - |
dc.contributor.nonIdAuthor | Jung, GJ | - |
dc.contributor.nonIdAuthor | Park, BJ | - |
dc.contributor.nonIdAuthor | Byun, KY | - |
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