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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Development of low temperature bonding using in-based solders

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dc.contributor.authorChoi, WK-
dc.contributor.authorYu, D-
dc.contributor.authorLee, C-
dc.contributor.authorYan, L-
dc.contributor.authorYu, A-
dc.contributor.authorYoon, SW-
dc.contributor.authorLau, JH-
dc.contributor.authorCho, MG-
dc.contributor.authorJo, YH-
dc.contributor.authorLee, Hyuck Mo-
dc.date.accessioned2013-03-26T23:23:39Z-
dc.date.available2013-03-26T23:23:39Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.1294 - 1299-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/157101-
dc.languageENG-
dc.titleDevelopment of low temperature bonding using in-based solders-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349084691-
dc.type.rimsCONF-
dc.citation.beginningpage1294-
dc.citation.endingpage1299-
dc.citation.publicationname2008 58th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorChoi, WK-
dc.contributor.nonIdAuthorYu, D-
dc.contributor.nonIdAuthorLee, C-
dc.contributor.nonIdAuthorYan, L-
dc.contributor.nonIdAuthorYu, A-
dc.contributor.nonIdAuthorYoon, SW-
dc.contributor.nonIdAuthorLau, JH-
dc.contributor.nonIdAuthorCho, MG-
dc.contributor.nonIdAuthorJo, YH-
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MS-Conference Papers(학술회의논문)
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