Sources of creep data scattering of solders in micro-electronic packaging
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, Jin | ko |
| dc.contributor.author | Shin, SW | ko |
| dc.contributor.author | Kim, SB | ko |
| dc.date.accessioned | 2013-03-26T01:41:36Z | - |
| dc.date.available | 2013-03-26T01:41:36Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-05-29 | - |
| dc.identifier.citation | 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.1796 - 1801 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156852 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Sources of creep data scattering of solders in micro-electronic packaging | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000247705500273 | - |
| dc.identifier.scopusid | 2-s2.0-35348885391 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1796 | - |
| dc.citation.endingpage | 1801 | - |
| dc.citation.publicationname | 57th Electronic Components and Technology Conference 2007, ECTC '07 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Sparks, NV | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Shin, SW | - |
| dc.contributor.nonIdAuthor | Kim, SB | - |
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