Filling of very fine via holes for 3-D SiP by using ionized metal plasma sputtering and electroplating
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Won-Jong | - |
| dc.contributor.author | Cho, BH | - |
| dc.date.accessioned | 2013-03-26T00:34:15Z | - |
| dc.date.available | 2013-03-26T00:34:15Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-04-18 | - |
| dc.identifier.citation | ICEP (International Conference on electronics packaging) 2007, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156420 | - |
| dc.language | ENG | - |
| dc.title | Filling of very fine via holes for 3-D SiP by using ionized metal plasma sputtering and electroplating | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | ICEP (International Conference on electronics packaging) 2007 | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Lee, Won-Jong | - |
| dc.contributor.nonIdAuthor | Cho, BH | - |
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