DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, HY | - |
dc.contributor.author | Kim, IH | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Jung, GJ | - |
dc.contributor.author | Park, BJ | - |
dc.contributor.author | Paik, KW | - |
dc.date.accessioned | 2013-03-26T00:22:03Z | - |
dc.date.available | 2013-03-26T00:22:03Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-11-19 | - |
dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/156346 | - |
dc.language | ENG | - |
dc.title | Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51249101107 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Son, HY | - |
dc.contributor.nonIdAuthor | Kim, IH | - |
dc.contributor.nonIdAuthor | Jung, GJ | - |
dc.contributor.nonIdAuthor | Park, BJ | - |
dc.contributor.nonIdAuthor | Paik, KW | - |
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