The Microstructure and Crystal Orientation of Sn-Ag and Sn-Cu solders Affected by their Interfacial Reactions with Cu and (Ni)p

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Issue Date
2009-03-18
Language
ENG
Citation

2009 TMS annual meeting (138th)

URI
http://hdl.handle.net/10203/156269
Appears in Collection
MS-Conference Papers(학술회의논문)
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