DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, YS | - |
dc.contributor.author | Kwon, YM | - |
dc.contributor.author | Moon, JT | - |
dc.contributor.author | Lee, YW | - |
dc.contributor.author | Lee, JH | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-26T00:03:44Z | - |
dc.date.available | 2013-03-26T00:03:44Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-12-09 | - |
dc.identifier.citation | 2009 11th Electronic Packaging Technology Conference, EPTC 2009, v., no., pp.321 - 324 | - |
dc.identifier.uri | http://hdl.handle.net/10203/156243 | - |
dc.language | ENG | - |
dc.title | Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-77950951114 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 321 | - |
dc.citation.endingpage | 324 | - |
dc.citation.publicationname | 2009 11th Electronic Packaging Technology Conference, EPTC 2009 | - |
dc.identifier.conferencecountry | Singapore | - |
dc.identifier.conferencecountry | Singapore | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Park, YS | - |
dc.contributor.nonIdAuthor | Kwon, YM | - |
dc.contributor.nonIdAuthor | Moon, JT | - |
dc.contributor.nonIdAuthor | Lee, YW | - |
dc.contributor.nonIdAuthor | Lee, JH | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.