Active circuit to through silicon via (TSV) noise coupling
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Cho, J. | ko |
| dc.contributor.author | Shim, J. | ko |
| dc.contributor.author | Song, E. | ko |
| dc.contributor.author | Pak, J.S. | ko |
| dc.contributor.author | Lee, J. | ko |
| dc.contributor.author | Lee, H. | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.date.accessioned | 2013-03-25T23:54:10Z | - |
| dc.date.available | 2013-03-25T23:54:10Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-10-19 | - |
| dc.identifier.citation | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.97 - 100 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156205 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | Active circuit to through silicon via (TSV) noise coupling | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000290737000025 | - |
| dc.identifier.scopusid | 2-s2.0-74549172091 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 97 | - |
| dc.citation.endingpage | 100 | - |
| dc.citation.publicationname | 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Portland, OR | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Cho, J. | - |
| dc.contributor.nonIdAuthor | Shim, J. | - |
| dc.contributor.nonIdAuthor | Song, E. | - |
| dc.contributor.nonIdAuthor | Pak, J.S. | - |
| dc.contributor.nonIdAuthor | Lee, J. | - |
| dc.contributor.nonIdAuthor | Lee, H. | - |
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