Effects of W addition in Ni(P) UBM on the solder joint reliability

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dc.contributor.authorJang, DM-
dc.contributor.authorYu, Jin-
dc.date.accessioned2013-03-19T05:14:37Z-
dc.date.available2013-03-19T05:14:37Z-
dc.date.created2012-02-06-
dc.date.issued2007-11-19-
dc.identifier.citationInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/156073-
dc.languageENG-
dc.titleEffects of W addition in Ni(P) UBM on the solder joint reliability-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51249101719-
dc.type.rimsCONF-
dc.citation.publicationnameInternational Conference on Electronic Materials and Packaging 2007, EMAP 2007-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorJang, DM-
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MS-Conference Papers(학술회의논문)
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