Effects of W addition in Ni(P) UBM on the solder joint reliability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jang, DM | - |
| dc.contributor.author | Yu, Jin | - |
| dc.date.accessioned | 2013-03-19T05:14:37Z | - |
| dc.date.available | 2013-03-19T05:14:37Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-11-19 | - |
| dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156073 | - |
| dc.language | ENG | - |
| dc.title | Effects of W addition in Ni(P) UBM on the solder joint reliability | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-51249101719 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Yu, Jin | - |
| dc.contributor.nonIdAuthor | Jang, DM | - |
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