DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kyo, S.C. | - |
dc.contributor.author | Il, Y.H. | - |
dc.contributor.author | Kim, SungJin | - |
dc.date.accessioned | 2013-03-19T04:30:23Z | - |
dc.date.available | 2013-03-19T04:30:23Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-28 | - |
dc.identifier.citation | 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM, v., no., pp.428 - 431 | - |
dc.identifier.uri | http://hdl.handle.net/10203/155768 | - |
dc.language | ENG | - |
dc.title | The effect of various wafer thicknesses on hot spot temperature | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-50949114422 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 428 | - |
dc.citation.endingpage | 431 | - |
dc.citation.publicationname | 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Kim, SungJin | - |
dc.contributor.nonIdAuthor | Kyo, S.C. | - |
dc.contributor.nonIdAuthor | Il, Y.H. | - |
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