DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yang, JH | - |
dc.contributor.author | Kim, YH | - |
dc.contributor.author | Moon, JS | - |
dc.contributor.author | Lee, Won-Jong | - |
dc.date.accessioned | 2013-03-19T03:44:24Z | - |
dc.date.available | 2013-03-19T03:44:24Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-08-14 | - |
dc.identifier.citation | 2007 8th International Conference on Electronic Packaging Technology, ICEPT, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/155383 | - |
dc.language | ENG | - |
dc.title | Chip-to-chip interconnection by mechanical caulking using reflowed Sn bumps | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-50249102128 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2007 8th International Conference on Electronic Packaging Technology, ICEPT | - |
dc.identifier.conferencecountry | China | - |
dc.identifier.conferencecountry | China | - |
dc.contributor.localauthor | Lee, Won-Jong | - |
dc.contributor.nonIdAuthor | Yang, JH | - |
dc.contributor.nonIdAuthor | Kim, YH | - |
dc.contributor.nonIdAuthor | Moon, JS | - |
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