Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 579
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorKim, I-
dc.contributor.authorJang, KW-
dc.contributor.authorSon, HY-
dc.contributor.authorKim, JH-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-19T03:07:18Z-
dc.date.available2013-03-19T03:07:18Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.219 - 224-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/155146-
dc.languageENG-
dc.titleWafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349085640-
dc.type.rimsCONF-
dc.citation.beginningpage219-
dc.citation.endingpage224-
dc.citation.publicationname2008 58th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKim, I-
dc.contributor.nonIdAuthorJang, KW-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorKim, JH-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0