Wetting Properties and Interfacial Reaction of Cu5Zn8-Bearing Pb-Free Solder on the Cu substrate by Mecanical Alloying
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyuck Mo | - |
| dc.date.accessioned | 2013-03-19T02:37:06Z | - |
| dc.date.available | 2013-03-19T02:37:06Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-03-17 | - |
| dc.identifier.citation | 2009 TMS annual meeting (138th), v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/154980 | - |
| dc.language | ENG | - |
| dc.title | Wetting Properties and Interfacial Reaction of Cu5Zn8-Bearing Pb-Free Solder on the Cu substrate by Mecanical Alloying | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2009 TMS annual meeting (138th) | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Lee, Hyuck Mo | - |
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