DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lu M. | - |
dc.contributor.author | Lauro P. | - |
dc.contributor.author | Shih D.-Y. | - |
dc.contributor.author | Polastre R. | - |
dc.contributor.author | Goldsmith C. | - |
dc.contributor.author | Henderson D.W. | - |
dc.contributor.author | Zhang H. | - |
dc.contributor.author | Cho M.G. | - |
dc.date.accessioned | 2013-03-19T01:58:38Z | - |
dc.date.available | 2013-03-19T01:58:38Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-27 | - |
dc.identifier.citation | 2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.360 - 365 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/154706 | - |
dc.language | ENG | - |
dc.title | Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51349136376 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 360 | - |
dc.citation.endingpage | 365 | - |
dc.citation.publicationname | 2008 58th Electronic Components and Technology Conference, ECTC | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Cho M.G. | - |
dc.contributor.nonIdAuthor | Lu M. | - |
dc.contributor.nonIdAuthor | Lauro P. | - |
dc.contributor.nonIdAuthor | Shih D.-Y. | - |
dc.contributor.nonIdAuthor | Polastre R. | - |
dc.contributor.nonIdAuthor | Goldsmith C. | - |
dc.contributor.nonIdAuthor | Henderson D.W. | - |
dc.contributor.nonIdAuthor | Zhang H. | - |
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