Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, JH | ko |
| dc.contributor.author | Jang, JW | ko |
| dc.contributor.author | Jang, KW | ko |
| dc.contributor.author | Paik, KW | ko |
| dc.contributor.author | Lee, Soon-Bok | ko |
| dc.date.accessioned | 2013-03-19T01:38:31Z | - |
| dc.date.available | 2013-03-19T01:38:31Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2009-06-15 | - |
| dc.identifier.citation | 2009 European Microelectronics and Packaging Conference, EMPC 2009 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/154556 | - |
| dc.language | English | - |
| dc.publisher | EMPC | - |
| dc.title | Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000274631600046 | - |
| dc.identifier.scopusid | 2-s2.0-70449768659 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2009 European Microelectronics and Packaging Conference, EMPC 2009 | - |
| dc.identifier.conferencecountry | IT | - |
| dc.identifier.conferencelocation | Rimini | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Park, JH | - |
| dc.contributor.nonIdAuthor | Jang, JW | - |
| dc.contributor.nonIdAuthor | Jang, KW | - |
| dc.contributor.nonIdAuthor | Paik, KW | - |
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.