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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of epoxy and rubber addition on die attach films (DAFs) materials properties

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dc.contributor.authorChoi, Yko
dc.contributor.authorJang, KWko
dc.contributor.authorChung, CKko
dc.contributor.authorLee S.ko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2013-03-19T00:58:33Z-
dc.date.available2013-03-19T00:58:33Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2009-05-26-
dc.identifier.citation59th Electronic Components and Technology Conference, ECTC 2009, pp.1525 - 1530-
dc.identifier.urihttp://hdl.handle.net/10203/154254-
dc.languageEnglish-
dc.publisher123-
dc.titleEffects of epoxy and rubber addition on die attach films (DAFs) materials properties-
dc.typeConference-
dc.identifier.wosid000271288900228-
dc.identifier.scopusid2-s2.0-70349668451-
dc.type.rimsCONF-
dc.citation.beginningpage1525-
dc.citation.endingpage1530-
dc.citation.publicationname59th Electronic Components and Technology Conference, ECTC 2009-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSan Diego, CA-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorChoi, Y-
dc.contributor.nonIdAuthorJang, KW-
dc.contributor.nonIdAuthorChung, CK-
dc.contributor.nonIdAuthorLee S.-
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MS-Conference Papers(학술회의논문)
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