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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Embedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)

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dc.contributor.authorSuk, KL-
dc.contributor.authorSon, HY-
dc.contributor.authorChung, CK-
dc.contributor.authorKim, JD-
dc.contributor.authorLee, JW-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-19T00:35:16Z-
dc.date.available2013-03-19T00:35:16Z-
dc.date.created2012-02-06-
dc.date.issued2009-05-26-
dc.identifier.citation59th Electronic Components and Technology Conference, ECTC 2009, v., no., pp.1741 - 1748-
dc.identifier.urihttp://hdl.handle.net/10203/154087-
dc.languageENG-
dc.titleEmbedded chip-in-flex (cif) packages using wafer level package (WLP) with pre-applied anisotropic conductive films (ACFs)-
dc.typeConference-
dc.identifier.scopusid2-s2.0-70349693602-
dc.type.rimsCONF-
dc.citation.beginningpage1741-
dc.citation.endingpage1748-
dc.citation.publicationname59th Electronic Components and Technology Conference, ECTC 2009-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSuk, KL-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorChung, CK-
dc.contributor.nonIdAuthorKim, JD-
dc.contributor.nonIdAuthorLee, JW-
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MS-Conference Papers(학술회의논문)
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