DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chuang, CC | - |
dc.contributor.author | Lu, ST | - |
dc.contributor.author | Chang, TC | - |
dc.contributor.author | Suk, KL | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-19T00:26:28Z | - |
dc.date.available | 2013-03-19T00:26:28Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-10-21 | - |
dc.identifier.citation | IMPACT Conference 2009 International 3D IC Conference, v., no., pp.56 - 59 | - |
dc.identifier.uri | http://hdl.handle.net/10203/154026 | - |
dc.language | ENG | - |
dc.title | 20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-77950814036 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 56 | - |
dc.citation.endingpage | 59 | - |
dc.citation.publicationname | IMPACT Conference 2009 International 3D IC Conference | - |
dc.identifier.conferencecountry | Taiwan, Province of China | - |
dc.identifier.conferencecountry | Taiwan, Province of China | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Chuang, CC | - |
dc.contributor.nonIdAuthor | Lu, ST | - |
dc.contributor.nonIdAuthor | Chang, TC | - |
dc.contributor.nonIdAuthor | Suk, KL | - |
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