20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives

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dc.contributor.authorChuang, CC-
dc.contributor.authorLu, ST-
dc.contributor.authorChang, TC-
dc.contributor.authorSuk, KL-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-19T00:26:28Z-
dc.date.available2013-03-19T00:26:28Z-
dc.date.created2012-02-06-
dc.date.issued2009-10-21-
dc.identifier.citationIMPACT Conference 2009 International 3D IC Conference, v., no., pp.56 - 59-
dc.identifier.urihttp://hdl.handle.net/10203/154026-
dc.languageENG-
dc.title20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77950814036-
dc.type.rimsCONF-
dc.citation.beginningpage56-
dc.citation.endingpage59-
dc.citation.publicationnameIMPACT Conference 2009 International 3D IC Conference-
dc.identifier.conferencecountryTaiwan, Province of China-
dc.identifier.conferencecountryTaiwan, Province of China-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorChuang, CC-
dc.contributor.nonIdAuthorLu, ST-
dc.contributor.nonIdAuthorChang, TC-
dc.contributor.nonIdAuthorSuk, KL-
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MS-Conference Papers(학술회의논문)
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