Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Hyun, JG | - |
| dc.contributor.author | Paik, Kyung-Wook | - |
| dc.contributor.author | Pak, JS | - |
| dc.date.accessioned | 2013-03-19T00:22:51Z | - |
| dc.date.available | 2013-03-19T00:22:51Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-10-22 | - |
| dc.identifier.citation | 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, v., no., pp.124 - 128 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/153996 | - |
| dc.language | ENG | - |
| dc.title | Fabrication and characterization of epoxy/bari0 composite embedded capacitor for high frequency behaviors | - |
| dc.type | Conference | - |
| dc.identifier.scopusid | 2-s2.0-64049119717 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 124 | - |
| dc.citation.endingpage | 128 | - |
| dc.citation.publicationname | 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 | - |
| dc.identifier.conferencecountry | Taiwan, Province of China | - |
| dc.identifier.conferencecountry | Taiwan, Province of China | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Hyun, JG | - |
| dc.contributor.nonIdAuthor | Pak, JS | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.