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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Using ultrasonic energy for reducing ACF bonding process time

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dc.contributor.authorJang T.-Y.-
dc.contributor.authorYun W.-S.-
dc.contributor.authorKim S.-H.-
dc.contributor.authorKim, Kyung-Soo-
dc.date.accessioned2013-03-19T00:12:05Z-
dc.date.available2013-03-19T00:12:05Z-
dc.date.created2012-02-06-
dc.date.issued2008-11-04-
dc.identifier.citation2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008, v., no., pp. --
dc.identifier.issn1089-8190-
dc.identifier.urihttp://hdl.handle.net/10203/153897-
dc.languageENG-
dc.titleUsing ultrasonic energy for reducing ACF bonding process time-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77955121952-
dc.type.rimsCONF-
dc.citation.publicationname2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008-
dc.identifier.conferencecountryMalaysia-
dc.identifier.conferencecountryMalaysia-
dc.contributor.localauthorKim, Kyung-Soo-
dc.contributor.nonIdAuthorJang T.-Y.-
dc.contributor.nonIdAuthorYun W.-S.-
dc.contributor.nonIdAuthorKim S.-H.-
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ME-Conference Papers(학술회의논문)
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