DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, S | - |
dc.contributor.author | Hyun, JG | - |
dc.contributor.author | Pak, JS | - |
dc.contributor.author | Lee, H | - |
dc.contributor.author | Jeon, HS | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-19T00:01:57Z | - |
dc.date.available | 2013-03-19T00:01:57Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-27 | - |
dc.identifier.citation | 2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.742 - 746 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/153822 | - |
dc.language | ENG | - |
dc.title | Fabrication and characterization of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs) | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51349122302 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 742 | - |
dc.citation.endingpage | 746 | - |
dc.citation.publicationname | 2008 58th Electronic Components and Technology Conference, ECTC | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, S | - |
dc.contributor.nonIdAuthor | Hyun, JG | - |
dc.contributor.nonIdAuthor | Pak, JS | - |
dc.contributor.nonIdAuthor | Lee, H | - |
dc.contributor.nonIdAuthor | Jeon, HS | - |
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