Wafer to wafer bonding using electroplated Co-Sn solder layer
- Publisher
- 123
- Issue Date
- 2008-10-22
- Language
- English
- Citation
2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008, pp.313 - 316
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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