DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Son, HY | ko |
dc.contributor.author | Kim, I | ko |
dc.contributor.author | Chung, CK | ko |
dc.date.accessioned | 2013-03-18T23:34:27Z | - |
dc.date.available | 2013-03-18T23:34:27Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-12-09 | - |
dc.identifier.citation | 10th Electronics Packaging Technology Conference, EPTC 2008, pp.450 - 456 | - |
dc.identifier.uri | http://hdl.handle.net/10203/153631 | - |
dc.language | English | - |
dc.publisher | 123 | - |
dc.title | Wafer level ACA packages and their applications to advanced electronic packaging | - |
dc.type | Conference | - |
dc.identifier.wosid | 000265818600072 | - |
dc.identifier.scopusid | 2-s2.0-63049127162 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 450 | - |
dc.citation.endingpage | 456 | - |
dc.citation.publicationname | 10th Electronics Packaging Technology Conference, EPTC 2008 | - |
dc.identifier.conferencecountry | SI | - |
dc.identifier.conferencelocation | Singapore | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Son, HY | - |
dc.contributor.nonIdAuthor | Kim, I | - |
dc.contributor.nonIdAuthor | Chung, CK | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.