DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, Jin | - |
dc.contributor.author | Kim, JY | - |
dc.contributor.author | Jurenka, C | - |
dc.contributor.author | Wolf, J | - |
dc.contributor.author | Engelmann, G | - |
dc.contributor.author | Herbert Reichl | - |
dc.date.accessioned | 2013-03-18T23:14:35Z | - |
dc.date.available | 2013-03-18T23:14:35Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004 | - |
dc.identifier.citation | EMAP 2004 Proceedings, v., no., pp.373 - 378 | - |
dc.identifier.uri | http://hdl.handle.net/10203/153490 | - |
dc.language | ENG | - |
dc.title | Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 373 | - |
dc.citation.endingpage | 378 | - |
dc.citation.publicationname | EMAP 2004 Proceedings | - |
dc.identifier.conferencecountry | Malaysia | - |
dc.identifier.conferencecountry | Malaysia | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Jurenka, C | - |
dc.contributor.nonIdAuthor | Wolf, J | - |
dc.contributor.nonIdAuthor | Engelmann, G | - |
dc.contributor.nonIdAuthor | Herbert Reichl | - |
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