Formation and characterization of cobalt-reinforced Sn-3.5Ag solder
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, JS | ko |
| dc.contributor.author | Chu, KM | ko |
| dc.contributor.author | Jeon, Duk Young | ko |
| dc.contributor.author | Patzelt, R | ko |
| dc.contributor.author | Manessis, D | ko |
| dc.contributor.author | Ostmann, A | ko |
| dc.date.accessioned | 2007-09-20T02:27:00Z | - |
| dc.date.available | 2007-09-20T02:27:00Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-05-30 | - |
| dc.identifier.citation | IEEE 56th Electronic Components and Technology Conference, pp.244 - 249 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1515 | - |
| dc.description.sponsorship | This work was supported by the Center for Electronic Packaging Materials (ERC) of MOST/KOSEF. | en |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Formation and characterization of cobalt-reinforced Sn-3.5Ag solder | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000238566600037 | - |
| dc.identifier.scopusid | 2-s2.0-33845586481 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 244 | - |
| dc.citation.endingpage | 249 | - |
| dc.citation.publicationname | IEEE 56th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Jeon, Duk Young | - |
| dc.contributor.nonIdAuthor | Lee, JS | - |
| dc.contributor.nonIdAuthor | Chu, KM | - |
| dc.contributor.nonIdAuthor | Patzelt, R | - |
| dc.contributor.nonIdAuthor | Manessis, D | - |
| dc.contributor.nonIdAuthor | Ostmann, A | - |
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