DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, M.H. | - |
dc.contributor.author | Cho, H.S. | - |
dc.contributor.author | Hwang, S.H. | - |
dc.contributor.author | Park, HyoHoon | - |
dc.contributor.author | Kim, K.R. | - |
dc.contributor.author | Lee, J. | - |
dc.date.accessioned | 2013-03-18T17:34:46Z | - |
dc.date.available | 2013-03-18T17:34:46Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-05-31 | - |
dc.identifier.citation | 55th Electronic Components and Technology Conference, ECTC, v.2, no., pp.1830 - 1834 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/150788 | - |
dc.language | ENG | - |
dc.publisher | Institute of Electrical and Electronics Engineers | - |
dc.title | Optical interconnection schemes using micro-optic connectors for passive packaging in optical PCBs | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-24644447064 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 2 | - |
dc.citation.beginningpage | 1830 | - |
dc.citation.endingpage | 1834 | - |
dc.citation.publicationname | 55th Electronic Components and Technology Conference, ECTC | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Park, HyoHoon | - |
dc.contributor.nonIdAuthor | Cho, M.H. | - |
dc.contributor.nonIdAuthor | Cho, H.S. | - |
dc.contributor.nonIdAuthor | Hwang, S.H. | - |
dc.contributor.nonIdAuthor | Kim, K.R. | - |
dc.contributor.nonIdAuthor | Lee, J. | - |
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