DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, BW | - |
dc.contributor.author | Jeong, JH | - |
dc.contributor.author | Jang, W | - |
dc.contributor.author | Kim, JY | - |
dc.contributor.author | Kim, DW | - |
dc.contributor.author | Kwon, D | - |
dc.contributor.author | Nah, JW | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-18T17:32:57Z | - |
dc.date.available | 2013-03-18T17:32:57Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003 | - |
dc.identifier.citation | The Third International Conference On Advanced Materials Development and Performance, v.17, no., pp.1983 - 1988 | - |
dc.identifier.issn | 0217-9792 | - |
dc.identifier.uri | http://hdl.handle.net/10203/150771 | - |
dc.language | ENG | - |
dc.publisher | The Third International Conference On Advanced Materials Development and Performance | - |
dc.title | Determination of stress-strain curve for microelectronic solder joint by ESPI measurement and FE analysis | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-0037931789 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 17 | - |
dc.citation.beginningpage | 1983 | - |
dc.citation.endingpage | 1988 | - |
dc.citation.publicationname | The Third International Conference On Advanced Materials Development and Performance | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, BW | - |
dc.contributor.nonIdAuthor | Jeong, JH | - |
dc.contributor.nonIdAuthor | Jang, W | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Kim, DW | - |
dc.contributor.nonIdAuthor | Kwon, D | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
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