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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM

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dc.contributor.authorYu, Jin-
dc.contributor.authorKim, JY-
dc.contributor.authorSohn, YC-
dc.date.accessioned2013-03-18T17:09:06Z-
dc.date.available2013-03-18T17:09:06Z-
dc.date.created2012-02-06-
dc.date.issued2005-
dc.identifier.citationMicro System Technologies 2005 Proceedings, v., no., pp.337 - 344-
dc.identifier.urihttp://hdl.handle.net/10203/150534-
dc.languageENG-
dc.titleInterfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage337-
dc.citation.endingpage344-
dc.citation.publicationnameMicro System Technologies 2005 Proceedings-
dc.identifier.conferencecountryGermany-
dc.identifier.conferencecountryGermany-
dc.contributor.localauthorYu, Jin-
dc.contributor.nonIdAuthorKim, JY-
dc.contributor.nonIdAuthorSohn, YC-
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MS-Conference Papers(학술회의논문)
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