DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.date.accessioned | 2013-03-18T17:08:12Z | - |
dc.date.available | 2013-03-18T17:08:12Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | Tokyo Tech-KAIST joint workshop, v., no., pp.3 - 4 | - |
dc.identifier.uri | http://hdl.handle.net/10203/150528 | - |
dc.language | ENG | - |
dc.title | Reliability Assessment of Advanced Electronics Packaging and MEMS(Key-Note Speech) | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 3 | - |
dc.citation.endingpage | 4 | - |
dc.citation.publicationname | Tokyo Tech-KAIST joint workshop | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
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