DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, Jin | - |
dc.contributor.author | Sohn, YC | - |
dc.contributor.author | Kim, JY | - |
dc.contributor.author | Jee, YK | - |
dc.contributor.author | Ko, YH | - |
dc.date.accessioned | 2013-03-18T16:19:45Z | - |
dc.date.available | 2013-03-18T16:19:45Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006 | - |
dc.identifier.citation | ICEP 2006, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/150153 | - |
dc.language | ENG | - |
dc.title | Impact Reliabilities of Lead-free Solder Joints with Ni(P), Cu and Ni metallizations | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | ICEP 2006 | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Sohn, YC | - |
dc.contributor.nonIdAuthor | Kim, JY | - |
dc.contributor.nonIdAuthor | Jee, YK | - |
dc.contributor.nonIdAuthor | Ko, YH | - |
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