Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array
- Issue Date
- 2005-06-05
- Language
- ENG
- Citation
13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05, v.2, pp.1969 - 1972
- Appears in Collection
- RIMS Conference Papers
- Files in This Item
- There are no files associated with this item.
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