Showing results 1 to 10 of 10
Controlled Wafer Release in Clustered Photolithography Tools: Flexible Flow Line Job Release Scheduling and an LMOLP Heuristic Park, Kyungsu; Morrison, James R, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.12, no.2, pp.642 - 655, 2015-04 |
Feedback Control of Cluster Tools for Regulating Wafer Delays Kim, Chulhan; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.13, no.2, pp.1189 - 1199, 2016-04 |
K-Cyclic Schedules and the Worst-Case Wafer Delay in a Dual-Armed Cluster Tool Roh, Dong-Hyun; Lee, Tae-Gyung; Lee, Tae-Eog, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.32, no.2, pp.236 - 249, 2019-05 |
Makespan Analysis of Lot Switching Period in Cluster Tools Lee, Jun-Ho; Kim, Hyunjung, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.29, no.2, pp.127 - 136, 2016-05 |
Non-Cyclic Scheduling of a Wet Station Kim, Hyunjung; Lee, Jun-Ho; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.11, no.4, pp.1262 - 1274, 2014-10 |
Noncyclic Scheduling of Cluster Tools With a Branch and Bound Algorithm Kim, Hyunjung; Lee, Jun-Ho; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.12, no.2, pp.690 - 700, 2015-04 |
Optimal scheduling for sequentially connected cluster tools with dual-armed robots and a single input and output module Kim, Dae-Kyu; Kim, Hyunjung; Lee, Tae-Eog, INTERNATIONAL JOURNAL OF PRODUCTION RESEARCH, v.55, no.11, pp.3092 - 3109, 2017-07 |
Optimal Scheduling of Transient Cycles for Single-Armed Cluster Tools With Parallel Chambers Kim, Dae-Kyu; Lee, Tae-Eog; Kim, Hyunjung, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.13, no.2, pp.1165 - 1175, 2016-04 |
Schedule Restoration for Single-Armed Cluster Tools Kim, Ja-Hee; Zhou, MengChu; Lee, Tae-Eog, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.27, no.3, pp.388 - 399, 2014-08 |
Scheduling Cluster Tools for Concurrent Processing of Two Wafer Types Lee, Jun-Ho; Kim, Hyunjung; Lee, Tae-Eog, IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING, v.11, no.2, pp.525 - 536, 2014-04 |
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