The Influence of Microstructure Change on Thermal Fatigue Life of Solder Ball
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Ryu, Jong-Eun | - |
| dc.contributor.author | Hwang, TK | - |
| dc.date.accessioned | 2013-03-18T15:37:33Z | - |
| dc.date.available | 2013-03-18T15:37:33Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005 | - |
| dc.identifier.citation | Tokyo Tech-KAIST joint workshop, v., no., pp.52 - 53 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/149819 | - |
| dc.language | ENG | - |
| dc.title | The Influence of Microstructure Change on Thermal Fatigue Life of Solder Ball | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 52 | - |
| dc.citation.endingpage | 53 | - |
| dc.citation.publicationname | Tokyo Tech-KAIST joint workshop | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.identifier.conferencecountry | Japan | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Ryu, Jong-Eun | - |
| dc.contributor.nonIdAuthor | Hwang, TK | - |
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