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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

10Gbps InGaP/GaAs Multi-channel TIA Module Utilizing LTCC 3D Structure10Gbps InGaP/GaAs Multi-channel TIA Module Utilizing LTCC 3D Structure

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Park, Chul Soonresearcher / Park, SH / Cho, YH
Publisher
WETOS 2004
Issue Date
2004-10-01
Language
KOR
Citation

WETOS 2004, v.0, no.0, pp.42 - 43

URI
http://hdl.handle.net/10203/149042
Appears in Collection
EE-Conference Papers(학술회의논문)
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