DSpace at KOASAS
College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Measuring interfacial fracture toughness of Si wafer/glass interface by blade test

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 334
  • Download : 0
Export
엄윤용researcher
Issue Date
2004
Language
KOR
Citation

한국 마이크로 전자및 패키징 학회, pp.11 -

URI
http://hdl.handle.net/10203/148983
Appears in Collection
ME-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Full Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0