DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yu, Jin | - |
dc.contributor.author | Sohn, YC | - |
dc.contributor.author | Jee, YK | - |
dc.contributor.author | Seo, HS | - |
dc.contributor.author | Kim, KH | - |
dc.contributor.author | Ahn, JH | - |
dc.contributor.author | Lee, YM | - |
dc.date.accessioned | 2013-03-18T13:41:23Z | - |
dc.date.available | 2013-03-18T13:41:23Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | IMAPS 2005 Proceedings, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/148943 | - |
dc.language | ENG | - |
dc.title | Comparison between Electroless Ni(P)Au and Cu OSP as a Surface Finish Layer of Mobile Application | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IMAPS 2005 Proceedings | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Sohn, YC | - |
dc.contributor.nonIdAuthor | Jee, YK | - |
dc.contributor.nonIdAuthor | Seo, HS | - |
dc.contributor.nonIdAuthor | Kim, KH | - |
dc.contributor.nonIdAuthor | Ahn, JH | - |
dc.contributor.nonIdAuthor | Lee, YM | - |
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