DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Paik, KW | - |
dc.contributor.author | Jeon, YD | - |
dc.contributor.author | Yang, SY | - |
dc.contributor.author | Kwon, YM | - |
dc.date.accessioned | 2013-03-18T12:59:59Z | - |
dc.date.available | 2013-03-18T12:59:59Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005 | - |
dc.identifier.citation | Pan Pacific Microelectronics symposium, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/148596 | - |
dc.language | ENG | - |
dc.title | A study on reliability of flip-chip solder joints using Pb-free solders and electroless Ni-P UBMs | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | Pan Pacific Microelectronics symposium | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Paik, KW | - |
dc.contributor.nonIdAuthor | Jeon, YD | - |
dc.contributor.nonIdAuthor | Yang, SY | - |
dc.contributor.nonIdAuthor | Kwon, YM | - |
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