DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Soon-Bok | - |
dc.contributor.author | Park, TS | - |
dc.contributor.author | Ham, SJ | - |
dc.date.accessioned | 2013-03-18T11:58:10Z | - |
dc.date.available | 2013-03-18T11:58:10Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2004 | - |
dc.identifier.citation | WCCM VI, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/148177 | - |
dc.language | ENG | - |
dc.title | Computational Mechanics Aided Reliability Assessment of Interconnections in Advanced Electronics Packaging | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | WCCM VI | - |
dc.identifier.conferencecountry | China | - |
dc.identifier.conferencecountry | China | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Park, TS | - |
dc.contributor.nonIdAuthor | Ham, SJ | - |
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