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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of Cooling Rates on IMC and Mechanical Properties of Sn-Ag-Cu / Cu Pad

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dc.contributor.authorLee, Hyuck Mo-
dc.contributor.authorJeong, SW-
dc.contributor.authorKim, JH-
dc.date.accessioned2013-03-18T09:23:59Z-
dc.date.available2013-03-18T09:23:59Z-
dc.date.created2012-02-06-
dc.date.issued2004-09-06-
dc.identifier.citationThe 66th World Foundry Congress, v., no., pp.91 - 102-
dc.identifier.urihttp://hdl.handle.net/10203/146964-
dc.languageENG-
dc.titleEffect of Cooling Rates on IMC and Mechanical Properties of Sn-Ag-Cu / Cu Pad-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage91-
dc.citation.endingpage102-
dc.citation.publicationnameThe 66th World Foundry Congress-
dc.identifier.conferencecountryTurkey-
dc.identifier.conferencecountryTurkey-
dc.contributor.localauthorLee, Hyuck Mo-
dc.contributor.nonIdAuthorJeong, SW-
dc.contributor.nonIdAuthorKim, JH-
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MS-Conference Papers(학술회의논문)
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