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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effects of additives on the defects of electroplated copper via in 3D SiP

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dc.contributor.authorLee, Won-Jong-
dc.contributor.authorCho, BH-
dc.contributor.authorJang, GH-
dc.date.accessioned2013-03-18T08:55:01Z-
dc.date.available2013-03-18T08:55:01Z-
dc.date.created2012-02-06-
dc.date.issued2006-09-10-
dc.identifier.citationUMRS-ICA-2006, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/146736-
dc.languageENG-
dc.titleEffects of additives on the defects of electroplated copper via in 3D SiP-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameUMRS-ICA-2006-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Won-Jong-
dc.contributor.nonIdAuthorCho, BH-
dc.contributor.nonIdAuthorJang, GH-
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MS-Conference Papers(학술회의논문)
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