Effects of additives on the defects of electroplated copper via in 3D SiP

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 299
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorLee, Won-Jong-
dc.contributor.authorCho, BH-
dc.contributor.authorJang, GH-
dc.date.accessioned2013-03-18T08:55:01Z-
dc.date.available2013-03-18T08:55:01Z-
dc.date.created2012-02-06-
dc.date.issued2006-09-10-
dc.identifier.citationUMRS-ICA-2006, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/146736-
dc.languageENG-
dc.titleEffects of additives on the defects of electroplated copper via in 3D SiP-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameUMRS-ICA-2006-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Won-Jong-
dc.contributor.nonIdAuthorCho, BH-
dc.contributor.nonIdAuthorJang, GH-
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0