IMP PVD 및 전기도금을 이용한 SIP용 via filling에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이원종 | - |
| dc.contributor.author | 조병훈 | - |
| dc.date.accessioned | 2013-03-18T08:26:34Z | - |
| dc.date.available | 2013-03-18T08:26:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2004-11-12 | - |
| dc.identifier.citation | IMAPS-Korea 2004 추계기술심포지움, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/146512 | - |
| dc.language | KOR | - |
| dc.title | IMP PVD 및 전기도금을 이용한 SIP용 via filling에 관한 연구 | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IMAPS-Korea 2004 추계기술심포지움 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 이원종 | - |
| dc.contributor.nonIdAuthor | 조병훈 | - |
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