열영동력이 수평 웨이퍼상의 입자침착에 미치는 영향

Abstract

To investigate thermophoretic effect on particle deposition, average deposition velocity toward a horizontal wafer surface in vertical airflow is measured keeping the wafer surface temperature different from the surrounding air temperature. In the present measurement, the temperature difference is maintained in the range from -10 to 4℃. Polystyrene latex (PSL) sphere of diameter between 0.3 and 0.8 μm are used for the experiment. The number of particles deposited on a wafer surface is estimated from the measurements using a wafer surface scanner (PMS SAS-3600). Experimental data are compared with prediction model results.