An evaluation of thermal deformation behavior in electronics package using UV moire interferometry

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dc.contributor.authorLee, Soon-Bok-
dc.contributor.authorPark, Jin-Hyung-
dc.date.accessioned2013-03-18T04:05:35Z-
dc.date.available2013-03-18T04:05:35Z-
dc.date.created2012-02-06-
dc.date.issued2005-
dc.identifier.citation2005 KSME Spring Conference, v., no., pp.10 - 10-
dc.identifier.urihttp://hdl.handle.net/10203/144594-
dc.languageKOR-
dc.titleAn evaluation of thermal deformation behavior in electronics package using UV moire interferometry-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage10-
dc.citation.endingpage10-
dc.citation.publicationname2005 KSME Spring Conference-
dc.identifier.conferencecountrySouth Korea-
dc.identifier.conferencecountrySouth Korea-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorPark, Jin-Hyung-
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ME-Conference Papers(학술회의논문)
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