An evaluation of thermal deformation behavior in electronics package using UV moire interferometry
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Park, Jin-Hyung | - |
| dc.date.accessioned | 2013-03-18T04:05:35Z | - |
| dc.date.available | 2013-03-18T04:05:35Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005 | - |
| dc.identifier.citation | 2005 KSME Spring Conference, v., no., pp.10 - 10 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/144594 | - |
| dc.language | KOR | - |
| dc.title | An evaluation of thermal deformation behavior in electronics package using UV moire interferometry | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 10 | - |
| dc.citation.endingpage | 10 | - |
| dc.citation.publicationname | 2005 KSME Spring Conference | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Park, Jin-Hyung | - |
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