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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Reliability assessment of BGA solder joints under cyclic bending loads

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dc.contributor.authorKim, Ilho-
dc.contributor.authorLee, Soon-Bok-
dc.date.accessioned2013-03-18T03:06:17Z-
dc.date.available2013-03-18T03:06:17Z-
dc.date.created2012-02-06-
dc.date.issued2005-12-11-
dc.identifier.citationEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, no., pp.27 - 32-
dc.identifier.urihttp://hdl.handle.net/10203/144178-
dc.languageENG-
dc.titleReliability assessment of BGA solder joints under cyclic bending loads-
dc.typeConference-
dc.identifier.scopusid2-s2.0-33847252388-
dc.type.rimsCONF-
dc.citation.volume2005-
dc.citation.beginningpage27-
dc.citation.endingpage32-
dc.citation.publicationnameEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorKim, Ilho-
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ME-Conference Papers(학술회의논문)
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