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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on double-layered metal bumps for fine pitch flip chip applications

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dc.contributor.authorSon, HY-
dc.contributor.authorYeo, YW-
dc.contributor.authorJung, GJ-
dc.contributor.authorLee, JK-
dc.contributor.authorChoi, JY-
dc.contributor.authorPark, CJ-
dc.contributor.authorSuh, MS-
dc.contributor.authorCho, SJ-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-18T01:21:52Z-
dc.date.available2013-03-18T01:21:52Z-
dc.date.created2012-02-06-
dc.date.issued2005-12-11-
dc.identifier.citationEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, no., pp.95 - 100-
dc.identifier.urihttp://hdl.handle.net/10203/143544-
dc.languageENG-
dc.titleStudies on double-layered metal bumps for fine pitch flip chip applications-
dc.typeConference-
dc.identifier.scopusid2-s2.0-33847331074-
dc.type.rimsCONF-
dc.citation.volume2005-
dc.citation.beginningpage95-
dc.citation.endingpage100-
dc.citation.publicationnameEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSon, HY-
dc.contributor.nonIdAuthorYeo, YW-
dc.contributor.nonIdAuthorJung, GJ-
dc.contributor.nonIdAuthorLee, JK-
dc.contributor.nonIdAuthorChoi, JY-
dc.contributor.nonIdAuthorPark, CJ-
dc.contributor.nonIdAuthorSuh, MS-
dc.contributor.nonIdAuthorCho, SJ-
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MS-Conference Papers(학술회의논문)
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