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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Study on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation

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dc.contributor.authorKwon, WS-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-18T00:01:07Z-
dc.date.available2013-03-18T00:01:07Z-
dc.date.created2012-02-06-
dc.date.issued2003-10-
dc.identifier.citation3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/143010-
dc.languageENG-
dc.titleStudy on thermal cycling reliability and delamination of anisotropic conductives adhesives flip chip on organic substrates with emphasis on the thermal deformation-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname3rd International IEEE Conference on Polymers and Adhesives In Microelectronics and Photonics-
dc.identifier.conferencecountrySwitzerland-
dc.identifier.conferencecountrySwitzerland-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKwon, WS-
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MS-Conference Papers(학술회의논문)
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